Over the past decade, high-density data centers have implemented many innovative solutions to combat the escalating temperatures generated by power-intensive computational tasks, such as those essential for artificial intelligence (AI) and high-performance computing (HPC). Using advanced cooling technologies can also help reduce energy consumption and as a result, lower greenhouse gas emissions.

Companies migrating to colocation facilities can use the latest and greatest methods for managing potentially damaging heat, lessening power usage, and minimizing environmental impact. Let’s explore five eco-friendly cooling innovations: direct-to-chip cooling, two-phase immersion cooling, microchannel liquid cooling, calibrated vector cooling (CVC), and rear-door heat exchange.

1. Direct-to-Chip Cooling

Direct-to-chip cooling is a method that involves pumping liquid—usually water or a water-glycol mixture—directly onto the server's processors to absorb the heat. This liquid then flows through a radiator or heat exchanger to dissipate the heat before being cycled back to the processors. It's like a continuous loop of heat absorption and dissipation, ensuring the processors stay at optimal temperatures.

Direct-to-chip cooling is a game-changer for high-power components like CPUs and GPUs because it targets the heat source directly. This method is better at cooling and cuts down on the need for massive airflow in the server room, making it a practical and feasible solution for high density environments. It’s like having a personalized cooling system for each chip, making it far more efficient than traditional air conditioning.

2. Two-Phase Immersion Cooling

Two-phase immersion cooling sounds like something from a sci-fi movie, but it’s very real and very hot (reverse pun). In fact, the immersion cooling market is projected to grow by $1.6 billion by 2030, according to Persistence Market Research. With two-immersion cooling, servers are submerged in a specially designed liquid coolant that boils at a low temperature (usually below 50°C). This liquid, often a dielectric fluid like mineral oil, doesn’t conduct electricity but has high thermal conductivity.

When the server heats up, the liquid around it starts to boil, creating vapor that rises to the top and condenses back into a liquid, releasing the heat. The cooled liquid then sinks back down to cool the servers again. This method is super energy-efficient, which is essential because air cooling units can account for up to 40% of a data center’s overall usage, according to the U.S. Department of Energy (DOE). Two-phase immersion cooling also eliminates the need for fans and other mechanical parts, which can extend the life of the server components.

3. Microchannel Liquid Cooling

Microchannel liquid cooling takes liquid cooling to a new level by using tiny channels to increase the surface area for heat transfer. Liquid (typically water or a water-glycol mix) flows through small channels in a cold plate that directly interacts with the processors. These channels are made of copper or aluminum and are just a few millimeters wide, allowing for efficient heat transfer.

One significant advantage of microchannel cooling is that it’s more compact and efficient than traditional heat exchangers. Colocation facilities that support microchannel cooling systems offer top-notch energy efficiency and cooling capacity, giving companies an edge without overhauling their data centers.

4. Calibrated Vector Cooling (CVC)

Calibrated vector cooling (CVC) is a smart mix of liquid and air cooling designed to manage server heat loads effectively. Instead of cooling everything uniformly, CVC directs the liquid to the hottest parts of the server using a calibrated approach. This targeted cooling means better performance and less overall cooling needed.

CVC systems use advanced control algorithms to ensure the liquid is delivered at the right temperature and flow rate for the server’s specific needs. This precise temperature management can boost system performance. Originally developed for blade servers, CVC is perfect for managing high-density setups. For companies moving to colocation facilities, CVC offers intelligent cooling that adapts to their needs, ensuring efficiency and cutting operational costs.

5. Rear-Door Heat Exchange (RDHx)

Rear-door heat exchange (RDHx) systems are ingenious. They use a heat exchanger mounted on the back of server racks to dissipate heat. Passive RDHx systems rely on the server's fans to push hot air through the heat exchanger, while active systems have extra fans to pull the hot air through. Both types use a liquid-filled coil to absorb the heat, which is cooled in a separate unit before reusing.

RDHx systems are ideal for scaling up cooling capacity as your deployment grows. They’re also great for retrofitting existing data centers without major disruptions. Companies using colocation facilities with RDHx technology can enjoy stable and efficient cooling, translating to better performance and lower energy costs.

Build Your Ideal High-Density Deployment

Migrating to colocation facilities offers a strategic advantage by enabling companies access to the latest data center cooling technology. Innovations like direct-to-chip cooling, two-phase immersion cooling, microchannel liquid cooling, calibrated vector cooling, and rear-door heat exchange ensure that your IT infrastructure operates at peak efficiency – reliably and sustainably.

As the need for high-density computing grows, efficient cooling solutions become even more critical. Colocation facilities equipped to support these technologies provide a future-ready platform for companies to thrive in our increasingly digital world. Embracing these innovations isn’t just about keeping up—it’s about leading the way in a rapidly evolving industry.